This is a high speed optical communication module specially designed for immersion cooling environments. All internal components are engineered and treated to operate reliably while being completely immersed in specific dielectric cooling fluids such as fluorocarbon or mineral oil, effectively addressing the heat dissipation challenges of high power data centers.
Form Factor: QSFP56 (Hot Pluggable)
Data Rate: 200 Gbps aggregate (212.5 Gb/s nominal, compliant with 200GBASE SR4 standard), backward compatible with 100GBASE SR4.
Core Function: Designed for short reach high speed data transmission (70 to 100 m) over multimode fiber (OM3, OM4, OM5), particularly suitable for data centers utilizing immersion cooling technology.
What Is an Immersion Cooling Optical Module
With the exponential growth of data intensive applications such as AI, machine learning, and high performance computing, conventional air cooling systems in data centers have reached their thermal management limits. As optical module data rates increase, so does power consumption, driving the demand for more efficient cooling solutions. Immersion cooling represents a paradigm shift in thermal management technology, offering significantly improved heat dissipation compared to traditional air cooling.
Unlike conventional transceivers that rely on airflow and heat sinks, immersion cooling optical modules are specifically designed to operate while fully submerged in dielectric coolant. Leveraging the superior thermal properties of liquids, they maintain optimal operating temperatures even under extreme workloads.
Technical Principle
Immersion cooling optical modules operate on the principle of direct liquid cooling, where heat generating components are submerged in a dielectric coolant that offers excellent thermal conductivity but no electrical conductivity. The cooling process combines conduction (direct heat transfer to the fluid), convection (circulating heated fluid away from the source), and in some systems, phase change cooling (boiling and condensation of the liquid).
Because dielectric fluids possess thermal conductivities 20 to 100 times greater than air and volumetric heat capacities about four times higher, they absorb and transfer heat far more effectively.
Key Design Features and Materials
The module’s construction relies on materials that can withstand long term exposure to cooling liquids without degradation.
Both chemical compatibility and optical interface integrity are critical since certain plastics, elastomers, and metal coatings can corrode, swell, or leach under immersion. Optical coupling design also requires refractive index matching between materials and fluids to ensure stable signal transmission.
Performance Advantages
Compared with air cooled counterparts, immersion cooling optical modules deliver up to 50 percent or more improvement in thermal efficiency. This enhancement supports higher power densities, handling modules exceeding 30 W per port.
Beyond thermal performance, immersion cooling cuts overall data
center energy consumption by eliminating high power fans and HVAC
systems that typically account for 30 to 40 percent of total energy
use.
As a result, immersion cooled infrastructures can achieve an overall
Power Usage Effectiveness (PUE) as low as 1.02 to 1.03, yielding
substantial operational cost and environmental benefits.
Product Highlights
Hermesys 200GBASE SR4 Immersion Cooling Optical Module is a high performance, high reliability product featuring:
|
Immersion Cooling Design: |
Optical components are specially sealed and coated to prevent coolant leakage, ensuring reliable operation even 10 m deep. |
|---|---|
| Coolant Compatibility: | Fully compatible with common dielectric coolants such as fluorocarbon and mineral oil. |
| Advanced Sealing: | Critical interfaces between laser and detector arrays and pigtail fibers are precisely sealed, a key distinction from standard transceivers. |
|
High Speed Transmission: |
Utilizes PAM4 modulation and built in DSP (digital signal processor) to achieve 53.125 Gb/s per channel. |
| Energy Efficiency: | Typical power < 4.1 W (maximum 4.5 W), supporting lower overall PUE in data centers. |
| Smart Monitoring: | Compliant with CMIS V4.0, supporting I²C digital diagnostic monitoring (DDM) for temperature, voltage, optical power, and more, facilitating intelligent network management and fault diagnosis. |
Technical Specifications
| Category | Key Parameter | Specification |
|---|---|---|
| Optical | Wavelength | 850 nm (VCSEL array) |
| Fiber Type / Reach | OM3: 70m; OM4/OM5: 100m | |
| Tx Output Power (per channel) | -6.5 dBm ～ +4.0 dBm | |
| Electrical | Supply Voltage | 3.3V ±5% |
| Power Consumption | Max 4.5 W (typical 4.1 W) | |
| Interface Level | CML (data), LVCMOS/LVTTL (control) | |
|
Mechanical & Environmental |
Operating Temp | Case 0 °C to +70 °C |
| Immersion Depth | Up to 10 m | |
|
Management & Safety |
Management Protocol | CMIS V4.0 |
| Laser Safety | IEC 60825-1 Class 1 (Eye safe) | |
| Compliance | RoHS, CE, FCC, UL and others |